第29届欧洲电子器件可靠性，失效物理与分析研讨会（29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF2018）于2018年10月1日至5日在丹麦奥尔堡举行。本次会议共收录文章126篇，会议文章均收录于ELSEVIER旗下期刊Journal of Microelectronics Reliability (SCI检索)。参会人数300余人，遍及全世界30多个国家与地区。

本课题组共被该会议录用文章4篇，涉及电力电子器件、系统可靠性，以及可靠性在线监测与热控制，反映了课题组多项纵向和横向课题相关成果。课题组博士研究生刘懿参会并做了口头汇报与海报张贴。

附：

[1] Yi Liu, Ping Liu, Huai Wang, Meng Huang and Xiaoming Zha, “Two-thermal-states model predictive control for IGBT in three-phase inverter,” Microelectronics Reliability, online.

[2] Tao Zheng, Meng Huang, Yi Liu and Xiaoming Zha, “Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration,” Microelectronics Reliability, online.

[3] Jingge Hu, Meng Huang, Yi Liu and Xiaoming Zha, ” Transient junction temperature estimation of IGBT using improved thermal model,” Microelectronics Reliability, online.

[4] Xiaoman Sun, Meng Huang, Yi Liu and Xiaoming Zha, ” Investigation of ANN based IGBT Online Condition Monitoring,” Microelectronics Reliability, online.